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2022
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09
Differences between aluminum nitride and silicon nitride ceramic substrates
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The aluminum nitride ceramic substrate and silicon nitride substrate play a very important role in the field of packaging products respectively. The aluminum nitride ceramic substrate and silicon nitride ceramic substrate have their own advantages and differences. Today, I would like to share the differences between aluminum nitride and silicon nitride ceramic substrate.
1、 Different aluminum nitride and silicon nitride ceramic substrates have different properties
The core component of aluminum nitride ceramic substrate is AIN tetrahedral crystal co bonded compound. The decomposition temperature at room temperature can reach 2450 °. It is a high temperature resistant material. The thermal conductivity of polycrystalline AIN is up to 260W/(m.k), 5-8 times higher than that of alumina, so it has good thermal shock resistance and can withstand extreme heat at 2200 ℃. In addition, aluminum nitride has the characteristics of being free from corrosion of molten aluminum, other molten metals and gallium arsenide, and especially has excellent corrosion resistance to molten aluminum. Coefficient of thermal expansion (4.5 × 10-6 ℃) and Si (3.5-4 × 10-6 ℃) and GaAs (6 × 10-6 ℃) matching; Good mechanical properties, bending strength higher than Al2O3 and BeO ceramics, can be sintered under normal pressure;
The aluminum nitride ceramic substrate and silicon nitride substrate play a very important role in the field of packaging products respectively. The aluminum nitride ceramic substrate and silicon nitride ceramic substrate have their own advantages and differences. Today, I would like to share the differences between aluminum nitride and silicon nitride ceramic substrate.
1、 Different aluminum nitride and silicon nitride ceramic substrates have different properties
The core component of aluminum nitride ceramic substrate is AIN tetrahedral crystal co bonded compound. The decomposition temperature at room temperature can reach 2450 °. It is a high temperature resistant material. The thermal conductivity of polycrystalline AIN is up to 260W/(m.k), 5-8 times higher than that of alumina, so it has good thermal shock resistance and can withstand extreme heat at 2200 ℃. In addition, aluminum nitride has the characteristics of being free from corrosion of molten aluminum, other molten metals and gallium arsenide, and especially has excellent corrosion resistance to molten aluminum. Coefficient of thermal expansion (4.5 × 10-6 ℃) and Si (3.5-4 × 10-6 ℃) and GaAs (6 × 10-6 ℃) matching; Good mechanical properties, bending strength higher than Al2O3 and BeO ceramics, can be sintered under normal pressure;
3、 The cost of aluminum nitride and silicon nitride ceramic substrate is different
The production cost of aluminum nitride ceramic substrate is different from that of silicon nitride ceramic substrate. With the same processing technology, the cost of silicon nitride ceramic substrate is higher, mainly because the cost of core materials is higher; In addition, for the same processing requirements, the prices of different processing technologies are different. The specific cost still needs to determine the drawing and process requirements as well as the quantity evaluation price.
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