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07
2022
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09
CMP polishing materials: key materials for chip manufacturing, and the market continues to expand
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CMP polishing materials are the key consumables for wafer surface flattening. The global market continues to expand and the domestic substitution process accelerates, which directly benefits upstream material manufacturers.
1. Key consumables of wafers, accounting for more than 80% of the cost
Chemical mechanical polishing (CMP) is a combination of chemical etching of chemical reagents and mechanical grinding of nano abrasive particles to achieve a highly flat wafer surface. With the iterative upgrading of the chip manufacturing process, the number of CMP polishing increases exponentially. According to DuPont data, currently, CMP polishing steps in logic chips below 7nm are about 30, and advanced chips can reach 42. Polishing liquid and pad are the core consumables of CMP polishing process, accounting for 49% and 33% of the cost of polishing materials respectively.
2. The market continued to expand, with a compound growth rate of 10% in the past five years
The research paper pointed out that China has three major conditions to undertake the third semiconductor industry transfer, and the CMP material market continues to expand due to the strong demand brought by the large-scale capital expenditure of the wafer factory and the upgrading of chip technology. According to SEMI data, the global market size of CMP polishing materials from 2014 to 2020 was 1.57 billion to 2.48 billion dollars, and the domestic market size of CMP polishing materials in 2020 was about 3.2 billion yuan, with a compound growth rate of about 10% in the past five years.
3. The head companies directly benefit from accelerated localization
For a long time, the polishing liquid market has been monopolized by American and Japanese enterprises. Cabot, Hitachi and Fujimei (CR3) together account for more than 60% of the market share of the polishing liquid market. With the continuous expansion of production capacity of domestic wafer enterprises represented by SMIC International, Changjiang Storage, Hefei Changxin, etc. in recent years, the localization of upstream core materials is imminent. We believe that at present, the localization rate of upstream core materials is generally low. Influenced by the continuous "supply interruption" events in recent years, the chip industry chain supply security awareness has risen to an unprecedented level, and upstream material manufacturers have welcomed a good opportunity to replace domestic products.
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