Aluminum nitride is a covalent bond compound with hexagonal wurtzite structure. Its theoretical density is 3.26g/cm3, Mohs hardness is 7-8, and decomposition temperature is 2200-2250 ℃
1) High thermal conductivity, 5-10 times as high as that of alumina ceramics, equivalent to beryllium oxide;
2) Thermal expansion coefficient (4.3 * 10-6/° C) matches with semiconductor silicon material (3.5-4.0 * 10-6/° C);
3) Good mechanical properties, higher than beryllium oxide ceramics, close to alumina;
4) Excellent electrical performance, high insulation resistance and low dielectric loss;
5) Good weldability and repeated welding.
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